APPLIED PHYSICS REVIEWS Nanoscale thermal transport. II. 2003–2012

Nanoscale thermal transport. II. 2003–2012 David G. Cahill, Paul V. Braun, Gang Chen, David R. Clarke, Shanhui Fan, Kenneth E. Goodson, Pawel Keblinski, William P. King, Gerald D. Mahan, Arun Majumdar, Humphrey J. Maris, Simon R. Phillpot, Eric Pop, and Li Shi Department of Materials Science and Engineering and the Frederick Seitz Materials Research Laboratory, University of Illinois, Urbana, Illinois 61801, USA Department of Mechanical Engineering, MIT, Cambridge, Massachusetts 02139, USA School of Engineering and Applied Sciences, Harvard University, Cambridge, Massachusetts 02138, USA Department of Electrical Engineering, Stanford University, Stanford, California 94305, USA Department of Mechanical Engineering, Stanford University, Stanford, California 94305, USA Department of Materials Science and Engineering, Rensselaer Polytechnic Institute, Troy, New York 12180, USA Department of Mechanical Sciences and Engineering, University of Illinois, Urbana, Illinois 61801, USA Department of Physics, Penn State University, University Park, Pennsylvania 16802, USA Department of Mechanical Engineering, University of California, Berkeley, California 94720, USA Department of Physics, Brown University, Providence, Rhode Island 02912, USA Department of Materials Science and Engineering, University of Florida, Gainseville, Florida 32611, USA Department of Electrical and Computer Engineering, University of Illinois, Urbana, Illinois 61801, USA Department of Mechanical Engineering, University of Texas, Autin, Texas 78712, USA